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Rebellions, SK Hynix Secure Two Joint Patents for AI Processing Technologies

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Samsung, STATS ChipPAC Jointly File 3 Semiconductor Packaging Patents

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Samsung, Mecaro Co-File Two Patents on Substrate Heating and Support Technologies

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Samsung Electronics, Kiturami Bumyang Co-File Patent for Cross-Flow Cooling Tower

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Samsung Electronics, KG Mobilians Co-File Patent for Split Payment Technology

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Knauf AG Prevails in Patent Challenge Against SFA's Transfer Shuttle System

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SK Hynix, Kovis Co-File Patents for Semiconductor Inspection Automation

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SK Hynix, TMC Co-File Patent for Modular Power Supply Lighting System

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SK Hynix, Ennopia Co-File Dual Catalyst Patent for Semiconductor Emissions

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SK Hynix, One Semicon Co-File I/O Interface Configuration Patent

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SK Hynix, Mirae Corp. Co-File Patent for Automated Graphic Chip Test Handler

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SK Hynix, FLC Co-File Three Korean Patents on Semiconductor Die Ejecting and Handling Equipment

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LG Electronics, Handok Clean Tech Co-File Zirconium-Based Water Filter Patent

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Samsung Electro-Mechanics, GSI Co-File PCB Gripping and Transfer Equipment Patents

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Laserssel Transfers Six Korean Probe Pin Patents to Individual Inventor

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Neontech Transfers Partial Ownership of Three Korean Patents to SK Hynix

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Kum Moon Steel Files Corrected Invalidity Trial Against Hanguk Iron & Steel Patent

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Deesys, R-Tech System Target Onion Software, Ntek Over Power Monitoring Patent

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TSMC Acquires 10 U.S. Semiconductor Patents From Infineon

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UMC Transfers 44 U.S. Semiconductor Patents To Stellar Semiconductor Japan

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FTSS Seeks Patent Ruling Against A-mers In Leak Sensor Dispute

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ZEUS Korea Launches Patent Challenge Against SinSungHains' Stir-Fry Pot Invention

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