 |
| (Source: SK Hynix) |
SK Hynix has jointly filed three Korean patent applications with FLC related to semiconductor die ejecting and handling technologies, according to Korean Intellectual Property Office filings. The patents remain pending and have not yet been registered.
The two companies jointly filed the applications between 2023 and 2024, and the inventions began to be published sequentially from January 2025.
The three applications are titled:
KR1020230083699 – "Collet Pocket and Collet Stocker"
KR1020240009619 – "Die Ejecting Apparatus"
KR1020240009621 – "Apparatus for Die Ejecting Comprising a Thin Ejecting Plate"
All three inventions describe precision pick-up and die-ejecting mechanisms used in semiconductor dicing and packaging processes, focusing on technologies that lift and separate individual chips (dies) from diced wafers with high positional accuracy and minimal mechanical stress.
The '699 application relates to a collet pocket alignment support structure designed to hold a die pick-up collet precisely in position. It features dual-axis alignment supports spaced apart along two perpendicular directions, preventing lateral and longitudinal displacement of the collet. The support widths are proportionally set between one-third and the full width of the collet to ensure stable positioning.
The '619 application covers a die ejecting apparatus using a metal and elastic plate combination with a central pocket protrusion that gently lifts the dicing tape from below. The structure reduces the adhesive area between the die and tape while maintaining uniform pressure distribution, thereby preventing die damage during detachment.
The '621 application describes a rod-driven elastic deformation-type die ejecting apparatus. The system includes an ejecting plate, ejector rod, and support base, which work together to bulge the elastic plate upward, lifting the die from the tape. The configuration provides controlled deformation, reduced adhesion, and enhanced precision for advanced semiconductor packaging lines.
By PatenTrip
Comments
Post a Comment