TSMC Acquires 11 U.S. Semiconductor Patents from Taiwanese Inventor

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Patent Portfolio Includes Semiconductor Packaging, LED, and Image Sensor Technologies

TSMC Acquires 11 U.S. Semiconductor Patents from Taiwanese Inventor
(Source: https://www.tsmc.com/english)

By PatenTrip

TSMC acquired 11 U.S. semiconductor patents from Taiwanese inventor Wen-Kun Yang in a transaction completed in November 2024. The patents cover technologies applicable to semiconductor packaging, LED chips, and image sensor devices.

Among the acquired patents, seven focus on semiconductor packaging technologies, including substrate structures (US8,237,257; US8,115,297; US8,304,287), stacked package designs (US8,106,504; US8,236,608), and general packaging techniques (US8,350,377; US9,379,081; US9,634,180).

The portfolio also includes two patents related to LED technology: one for LED chips (US8,299,488) and another for LED packaging (US9,117,941). Additionally, one patent (US8,232,633) covers image sensor packaging with dual substrates.

TSMC Acquires 11 U.S. Semiconductor Patents from Taiwanese Inventor
(Source: USPTO)

The following table lists the 11 U.S. patents acquired by TSMC (Source: USPTO): 

Patent    Application    Invention title

8237257 12232847 SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE SURFACES AND METHOD OF THE SAME

8106504 12385358 STACKING PACKAGE STRUCTURE WITH CHIP EMBEDDED INSIDE AND DIE HAVING THROUGH SILICON VIA AND METHOD OF THE SAME

8115297 12591812 SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE SURFACES AND METHOD OF THE SAME

8350377 12855705 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHOD FOR THE SAME

8299488 12970194 LED CHIP

8236608 13093226 STACKING PACKAGE STRUCTURE WITH CHIP EMBEDDED INSIDE AND DIE HAVING THROUGH SILICON VIA AND METHOD OF THE SAME

8304287 13170589 SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE SURFACES AND METHOD OF THE SAME

8232633 13289864 IMAGE SENSOR PACKAGE WITH DUAL SUBSTRATES AND THE METHOD OF THE SAME

9379081 14223157 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

9117941 14485370 LED Package and Method of the Same

9634180 14578483 Method for Forming Semiconductor Device Package with Slanting Structures

By PatenTrip

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