Ajinomoto Wins Korean Patent Appeal Over Circuit Board Tech on March 22, 2025 ABF Ajinomoto packaging patent PCB semiconductor substrate +
Chinese Yibu Semiconductor Reclaims Korean Semiconductor Packaging Patent on March 07, 2025 baoshan China chip packaging patent patentrip semiconductor shanghai Yibu Semiconductor +
Chip Packaging Attacks Infineon With Patent Infringement Suit Over NXP-Acquired Patents on February 15, 2025 chip Chip Packaging Infineon NXP packaging patent patentrip semiconductor +
Wells Fargo Releases SK Microworks Patent Collateral After One Year on September 27, 2024 film heat-shrinkable packaging patent patentrip PET polyester SK SK Microworks SKC Wells Fargo +