Litigation Spotlights a Portfolio of 41 Semiconductor Packaging Patents Acquired from NXP USA, Inc.
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(Source: https://www.nxp.com/docs/en/supporting-information/Corporate-Sustainability-Report-2023.pdf) |
By PatenTrip
Chip Packaging Technologies, LLC ("Chip Packaging") has filed a patent infringement lawsuit against Infineon Technologies AG ("Infineon"), leveraging semiconductor packaging patents it acquired from NXP USA, Inc. in July 2024.
The suit, initiated in the Eastern District of Texas in February 2025, alleges that Infineon has infringed five key patents covering packaging technologies.
The five asserted patents include:
U.S. Patent No. 9,263,299 – Exposed Die Clip Bond Power Package
U.S. Patent No. 9,299,646 – Lead Frame with Power and Ground Bars
U.S. Patent No. 8,258,611 – Leadframe Structure for Electronic Packages
U.S. Patent No. 9,685,351 – Wire Bond Mold Lock Method and Structure
U.S. Patent No. 8,394,713 – Method of Improving Adhesion of Bond Pad Over Pad Metallization with a Neighboring Passivation Layer by Depositing a Palladium Layer
These patents form part of a broader portfolio of 41 U.S. semiconductor packaging patents that Chip Packaging acquired from NXP USA, Inc. The portfolio encompasses technologies in several areas of semiconductor packaging, including:
Lead Frame-Based Packaging
Heat Dissipation and Thermal Management Packaging
Cap Element and Shielding Packaging
Sensor and Pressure Sensor Packaging
Package Assembly, Interconnect, and Structural Support
Sensor Integration and Multifunctional Packaging
Process and Material Enhancements
This marks the first time that Chip Packaging has taken legal action after acquiring 41 U.S. semiconductor packaging patents from NXP USA.
Below is the list of 41 U.S. semiconductor packaging patents that Chip Packing acquired from NXP USA in July 2024 (Source: USPTO).
Patent Application Invention title
7772036 11398944 LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING
8736034 11816038 LEAD-FRAME CIRCUIT PACKAGE
8394713 12705021 Method of Improving Adhesion of Bond Pad Over Pad Metallization with a Neighboring Passivation Layer by Depositing a Palladium Layer
8659146 12813903 LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING
8536684 13092162 METHOD OF ASSEMBLING SHIELDED INTEGRATED CIRCUIT DEVICE
8716846 13293119 PRESSURE SENSOR AND METHOD OF PACKAGING SAME
8859336 13398816 METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
8890308 13441448 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
8810020 13530118 SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
8790964 13538585 POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR
8643189 13550627 PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
9159643 13618185 MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
8836105 13681437 SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
9064838 14029779 HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE
9676611 14057262 SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS
9190352 14086942 MULTI-DIE SENSOR DEVICE
9305898 14161706 SEMICONDUCTOR DEVICE WITH COMBINED POWER AND GROUND RING STRUCTURE
8802474 14219011 PRESSURE SENSOR AND METHOD OF PACKAGING SAME
9297713 14220121 PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
None 14285079 LEAD-FRAME CIRCUIT PACKAGE
9129930 14331724 POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFORE
9685351 14335366 Wire Bond Mold Lock Method and Structure
9093438 14459331 SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
9196578 14459337 COMMON PIN FOR MULTI-DIE SEMICONDUCTOR PACKAGE
9299645 14551075 SEMICONDUCTOR DEVICE HAVING LEAD FRAME WITH NOTCHED INNER LEADS
9613941 14552442 EXPOSED DIE POWER SEMICONDUCTOR DEVICE
9548263 14741088 SEMICONDUCTOR DEVICE PACKAGE FOR DEBUGGING AND RELATED FABRICATION METHODS
9299646 14833135 LEAD FRAME WITH POWER AND GROUND BARS
9355945 14843967 SEMICONDUCTOR DEVICE WITH HEAT-DISSIPATING LEAD FRAME
9640469 14850070 Matrix Lid Heatspreader for Flip Chip Package
9362212 14850958 INTEGRATED CIRCUIT PACKAGE HAVING SIDE AND BOTTOM CONTACT PADS
10364140 14861886 INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE
9449901 14887304 LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
10151658 15356622 PRESSURE-SENSING INTEGRATED CIRCUIT DEVICE WITH DIAPHRAGM
10381295 15701572 LEAD FRAME HAVING REDISTRIBUTION LAYER
10431534 15864348 PACKAGE WITH SUPPORT STRUCTURE
10217700 15980572 LEAD FRAME FOR INTEGRATED CIRCUIT DEVICE HAVING J-LEADS AND GULL WING LEADS
10566268 16142623 PACKAGE TO DIE CONNECTION SYSTEM AND METHOD THEREFOR
11021363 16440446 INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE
11498829 16744577 NO-GEL PRESSURE SENSOR PACKAGE
11760623 18045677 NO-GEL PRESSURE SENSOR PACKAGE
By PatenTrip
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