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| (Source: SK Microworks America) |
Wells Fargo Bank has released its lien on 14 patents held by SK Microworks America, Inc., as of August 29, 2024.
SK Microworks America initially used the 14 patents as collateral in mid-August 2023. With the release of the lien just one year later, it is presumed that SK Microworks has either fully repaid the associated loan or met other conditions that led to the release.
The patents in question relate to the recycling of polyester and the manufacturing of containers using heat-shrinkable films. The technologies include methods for reproducing polyester containers using heat-shrinkable and polyester films, manufacturing recycled polyester chips, and packaging solutions involving polyester containers and heat-shrinkable labels.
These patents are significant for use in the recycling and packaging industries. Heat-shrinkable films play a key role in packaging technology, while the polyester container reproduction methods align with eco-friendly, sustainable practices in the industry.
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