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| (Source: https://www.shbsq.gov.cn/shbs/en/newscenter/20230721/367967.html) |
By PatenTrip
Chinese Yibu Semiconductor Co. Ltd. has secured another chance to register its patent for semiconductor packaging technology after the Korean Patent Trial and Appeal Board issued a cancellation remand decision on its rejection appeal.
The ruling requires further review by the Korean Intellectual Property Office (KIPO), potentially paving the way for eventual patent approval.
Yibu Semiconductor, which applied for the patent titled "A method of packaging semiconductor, semiconductor assembly and electronic device comprising the same" (Application No. KR1020210164040), filed an appeal with the Korean Patent Tribunal in November 2024 after the patent office initially refused registration. In a ruling issued in March 2025, the Tribunal sided with Yibu Semiconductor and vacated the original rejection, clearing the way for patent registration.
The patented technology covers a method of semiconductor packaging, a corresponding semiconductor assembly, and an electronic device incorporating the assembly.
In July 2023, the company inaugurated its first advanced packaging production line in Shanghai's Baoshan District, with expectations of reaching mass production within six months—a move that the firm claims will bolster regional efforts to establish Baoshan as a major hub for science and technology innovation.
By PatenTrip
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