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| (Source: Kiturami Bumyang) |
Samsung Electronics and Kiturami Bumyang have jointly filed a patent for a Cross-Flow Cooling Tower, marking the first patent co-filing between the two companies and signaling new collaboration in advanced thermal management technologies.
The patent describes a cross-flow cooling tower structure that enhances heat exchange efficiency between air and cooling water. The system includes a casing forming the tower's exterior, a water supply section for delivering and distributing cooling water, a blower section consisting of a fan and motor to drive airflow, a heat exchange section for air–water contact and heat dissipation, and a support structure that stably holds the motor and fan assembly.
Designed to maximize cooling efficiency through optimized air–water interaction, the technology can be applied to data centers, semiconductor fabs, and large-scale server rooms, where effective thermal control is essential to ensuring stable operations.
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