Samsung, Mecaro Co-File Two Patents on Substrate Heating and Support Technologies

(Source: Mecaro)

Samsung Electronics and Mecaro jointly filed two Korean patents, marking their first collaboration in semiconductor process equipment development.

The first patent, titled "Substrate Processing Apparatus" (Korean Patent Application No. 10-2023-0106418), was filed in August 2023 and published in November 2024. The second, "Substrate Support Device and Semiconductor Manufacturing Apparatus Comprising the Same" (Korean Patent Application No. 10-2024-0038850), was filed in March 2024 and published in September 2025.

The first invention covers a substrate processing apparatus featuring a multi-stage protrusion structure and multi-layer embossing pattern on the heater surface. This design enhances heat transfer uniformity and gas flow control, improving film thickness consistency, thermal stability, and contamination reduction during semiconductor fabrication processes.

The second invention discloses a substrate support device for semiconductor manufacturing equipment that utilizes a centrally focused spiral heater structure and thermal loss suppression design. According to the filing, this configuration improves wafer temperature uniformity and deposition quality while reducing process costs and increasing production efficiency.

By PatenTrip