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| (Source: Resonac) |
Japan's Resonac has failed to defend its Korean patent (KR2570822), titled "Adhesive Film and Dicing/Die Bonding Film", as the Korean Intellectual Property Trial and Appeal Board (IPTAB) invalidated four of its claims. On March 19, 2025, the IPTAB ruled to cancel claims 1–3 and 5 following a patent cancellation petition filed on February 19, 2024.
The patent centers on an adhesive film designed to enhance both adhesion and thermal conductivity in semiconductor packaging, particularly during dicing and die bonding processes.
The film is composed of an acrylic resin, an epoxy resin, a curing agent, and a high-purity polyhedral α-alumina filler. This filler, making up 60% to 95% of the total film composition by weight, is key to achieving high thermal performance while maintaining strong lamination and bonding properties. Resonac claimed that the invention addresses the thermal stress challenges common in heterogeneous semiconductor assemblies.
Resonac has 30 days to appeal the IPTAB’s decision to the Korean Patent Court by filing a lawsuit against the Commissioner of the Korean Intellectual Property Office.
By PatenTrip
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