Taiwanese Firm Buys 9 Patents from Independent Inventor
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| A figure from the patent, titled 'Method for Fabricating Glass Substrate Package (Patent No.: 9,615,453) (Source: USPTO) |
By PatenTrip
MYW Semitech, LLC, a Taiwanese company, acquired nine U.S. patents related to glass substrates for semiconductor packages from an independent inventor in December 2024.
According to records from the U.S. Patent and Trademark Office (USPTO), the patents were purchased from Mr. Ping-Jung Yang, the independent inventor. The portfolio includes four patents focused on glass substrate package fabrication and five patents related to chip packages.
The acquired patents include U.S. Patent '453, which describes a glass core substrate with copper-tungsten alloy conductors passing through it, featuring dielectric and metal layers for electrical connectivity. U.S. Patent '310 focuses on a display device with a glass substrate positioned over a display panel substrate, where metal bumps connect the contact pads on the display panel substrate to the glass substrate, enabling precise electrical connections. Similarly, U.S. Patent '565 details a glass core substrate with conductors aligned with its surfaces, along with dielectric and metal layers for improved electrical performance. U.S. Patent '819 builds on the same principles, describing a glass core substrate with copper-tungsten conductors, dielectric and metal layers, and a coplanar alignment for reliable electrical connections.
The full list of patents acquired by MYW Semitech is as follows (Source: USPTO):
Patent Application Invention title
9615453 14036256 METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
10622310 15261956 METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
10096565 15476999 METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
10453819 16139040 METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
11107768 16752650 CHIP PACKAGE
11538763 17372459 CHIP PACKAGE
11894306 17985827 CHIP PACKAGE
12062618 18524118 CHIP PACKAGE
None 18778983 CHIP PACKAGE
By PatenTrip
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