SK hynix and Namics Expand Joint Patent Filings in South Korea to Two on April 18, 2025 liquid epoxy resin mold Namics semiconductor SK Hynix TSV + underfill liquid epoxy resin mold Namics semiconductor SK Hynix TSV underfill
TSMC Transfers 32 U.S. Semiconductor Patents to Mago Barca IP on April 18, 2025 FinFET IC Longhorn IP Mago Barca IP patent semiconductor TSMC + TSV FinFET IC Longhorn IP Mago Barca IP patent semiconductor TSMC TSV