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| Figures from the joint patent filed by SK hynix and Namics Corporation with the Korean Intellectual Property Office, titled "Liquid Epoxy Resin Composition for Use as Mold Underfill Material for TSV" (Application No. KR1020230168000) (Source: KIPRIS) |
SK hynix and Namics Corporation have expanded their joint patent filings in South Korea, with the addition of two patent applications.
The latest application, titled "Liquid Epoxy Resin Composition for Use as Mold Underfill Material for TSV" (Application No. KR1020230168000), was publicly disclosed in January 2025. The technology was originally filed in November 2023.
This patent relates to a liquid epoxy resin composition that is crucial for TSV (Through Silicon Via) technology. TSV is a method used to interconnect multiple layers of semiconductor chips, and the mold underfill material plays a crucial role in ensuring the device's performance and reliability.
The liquid epoxy resin composition is primarily used in the manufacturing of electronic components, enhancing their performance and longevity. The composition has the ability to effectively dissipate heat generated during semiconductor device operation, thereby preventing performance degradation due to overheating. Additionally, the composition offers high reliability, ensuring that the electronic components made from it will not suffer from issues such as short circuits, maintaining stable operation over long periods.
This marks the second joint patent filing between SK hynix and Namics in South Korea. The companies had previously filed a patent titled "Molded Underfill Composition for TSV" (Application No. KR1020220057882) in May 2022, which was disclosed in August 2023.
The two patents filed in South Korea share similar characteristics, with both focusing on TSV-related mold underfill materials.
The companies also filed a related patent family in the U.S., titled "Liquid Epoxy Resin Composition for Use as Mold Underfill Material for TSV" (U.S. Application No. US18/770,676), which was disclosed in January 2025.
By PatenTrip
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