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| TC Bonder 'SFM5-Expert' Source: Hanwha) |
Samsung Electronics and Hanwha Semitek have jointly filed two Korean patent applications covering surface-mount technology, marking the first collaboration between the companies on intellectual property filings.
The companies submitted their first joint application, Component Mounting Equipment (KR10-2024-0009789), on Jan. 22, 2024. The filing describes technology for optimizing operations of multi-line, multi-head component mounting equipment. It was published on July 29, 2025, but remains unregistered.
Three days later, on Jan. 25, 2024, they filed Mounting Apparatus, Nozzle Inspection Unit for Mounting Apparatus, Bad Nozzle Ejection Unit for Mounting Apparatus (KR10-2024-0011723), which covers nozzle performance inspection, maintenance, and defective nozzle ejection in mounting apparatuses. That application was published on Aug. 1, 2025, and also remains unregistered.
In May 2025, Hanwha Semitek established a dedicated Advanced Packaging Equipment Development Center and significantly expanded its technical workforce, with plans to focus on new technologies such as hybrid bonding.
At the time, Hanwha Semitek said it had “joined the NVIDIA supply chain” in March after successfully mass-producing TC bonders worth 42 billion won ($30 million), adding that the organizational overhaul had provided “new momentum to lead the next-generation HBM semiconductor equipment market.”
By PatenTrip
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