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| (Source: AMAT) |
Applied Materials has once again failed to secure a Korean patent for its carbon film deposition technology, titled "Pulsed Plasma (DC/RF) Deposition of High Quality C Films for Patterning" (Application No. 10-2020-7034601).
On May 23, 2025, the Korean Intellectual Property Trial and Appeal Board (KIPTAB) dismissed AMAT's appeal against the Korean Intellectual Property Office's rejection of the patent application. AMAT had sought to overturn the rejection through a refusal appeal trial, but the Board sided with the examiner's original decision. The company may still challenge the ruling by filing a cancellation suit with the Korean Patent Court.
The patent describes a method for depositing an amorphous carbon layer—including over previously formed layers on a substrate—using a plasma-enhanced chemical vapor deposition (PECVD) process.
The corresponding U.S. family patents include U.S. Patent No. 11,603,591 and U.S. Application No. 18/119,406, both bearing the same title.
By PatenTrip
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