LIGHTIZER Also Transfers South Korean Patents to AGASEMICON
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| (Source: https://agasemicon.com/company/index.php) |
By PatenTrip
LIGHTIZER transferred six U.S. patents to AGASEMICON Corp. in October 2024. The two companies share the same representative and are headquartered at the same address.
Founded in December 2023, AGASEMICON focuses on Mini LED, Micro LED, and Chip Scale Packaging (CSP) technologies. Headquartered in Yongin, Gyeonggi Province, South Korea, the company operates production facilities in South Korea, China, and Vietnam. It also collaborates with JDM partners in China and Taiwan to advance next-generation display technologies, according to its website.
The six patents transferred from LIGHTIZER significantly enhance AGASEMICON's intellectual property in LED packaging, CSP, and LED chip transfer technologies. Two key patents emphasize photosensitive transfer resin, a critical component in advanced Micro LED and CSP applications:
Application No. 17617561: Focuses on the use of photosensitive resin for transferring LED chips to display devices, highlighting precision and efficiency.
Application No. 17666218: Examines the general characteristics of transfer resins and their role in LED chip transfer apparatus, complementing the first patent.
In August 2024, LIGHTIZER transferred South Korean patents to AGASEMICON. further solidifying their collaboration in LED and display technologies. The transfer complements the six U.S. patents LIGHTIZER transferred to AGASEMICON in October 2024.
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| (Source: https://agasemicon.com/en/product/application.php) |
The full list of transferred patents, including registration numbers, application numbers, and invention titles, is available below.
Patent Application Invention title
9929309 14609777 LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
9590156 14618114 LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
10950762 16333584 ROUND CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREFOR
None 17600403 LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURING SAME
None 17617561 A PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, A METHOD OF TRANSFERRING AN LED CHIP USING THE PHOTOSENSITIVE TRANSFER RESIN, AND A METHOD OF MANUFACTURING A DISPLAY DEVICE USING THE SAME
None 17666218 TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, AND AN APPARATUS FOR TRANSFERRING AN LED CHIP BY USING THE SAME
By PatenTrip
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