Patents Poised for Licensing or Enforcement in Semiconductor Sector
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| (Source: https://www.tsmcmoi.com/en/) |
By PatenTrip
Taiwan Semiconductor Manufacturing Company Limited (TSMC) transferred 195 U.S. patents to Parabellum Strategic Opportunities Fund LLC, a Delaware-based entity, in July 2024.
The transferred patents predominantly focus on advanced technologies in the semiconductor and microelectronics industries.
The patents encompass critical innovations in the design, manufacturing, and packaging of semiconductor devices, including processors, memory devices, and integrated circuits (ICs). They are categorized into six primary technology groups: Semiconductor Device Design and Fabrication, Semiconductor Packaging and Interconnects, Advanced Lithography and Etching Processes, Thermal and Mechanical Reliability, Image Sensor Technologies, and Circuit Interconnects and Integration.
Potential applications for these patents span areas such as Advanced Chip Manufacturing, 3D Packaging, Thermal and Reliability Solutions, and Optoelectronics.
Despite no patent infringement lawsuits filed by Parabellum to date, the transfer suggests possible monetization strategies through licensing, enforcement actions, or strategic collaborations within the semiconductor industry.
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| (Source: USPTO) |
The following is a detailed list of application numbers and invention titles for the 195 U.S. patents transferred by TSMC to Parabellum Strategic Opportunities Fund LLC. (Source: USPTO)
Application Invention title
11531290 METHODS FOR FABRICATING IMAGE SENSOR DEVICES
11945022 STRUCTURES FOR PREVENTING CROSS-TALK BETWEEN THROUGH-SILICON VIAS AND INTEGRATED CIRCUITS
12423422 CHEMICAL MECHANICAL POLISHING (CMP) METHOD FOR GATE LAST PROCESS
12536629 NOVEL HIGH-K METAL GATE CMOS PATTERNING METHOD
12619468 COPPER BUMP JOINT STRUCTURES WITH IMPROVED CRACK RESISTANCE
12706809 INTEGRATED SEMICONDUCTOR STRUCTURE FOR SRAM AND FABRICATION METHODS THEREOF
12710441 METHODS FOR FABRICATING IMAGE SENSOR DEVICES
12713395 NOVEL STRUCTURES AND METHODS TO STOP CONTACT METAL FROM EXTRUDING INTO REPLACEMENT GATES
12731411 INTEGRATED CIRCUIT INCLUDING FINFETS AND METHODS FOR FORMING THE SAME
12769725 PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE
12781960 PACKAGE SYSTEMS HAVING INTERPOSERS WITH INTERCONNECTION STRUCTURES
12823851 EMBEDDED 3D INTERPOSER STRUCTURE
12831925 CONTROLLING THE SHAPE OF SOURCE/DRAIN REGIONS IN FINFETS
12837093 FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE AND METHOD OF MANUFACTURING SAME
12842304 ROBUST JOINT STRUCTURE FOR FLIP-CHIP BONDING
12904506 CONDUCTIVE PILLAR STRUCTURE
12906820 FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE AND METHOD OF MANUFACTURING SAME
12953130 MOLDED CHIP INTERPOSER STRUCTURE AND METHODS
13007235 DISTRIBUTED METAL ROUTING
13025414 END-TO-END GAP FILL USING DIELECTRIC FILM
13035517 PREVENTING THE CRACKING OF PASSIVATION LAYERS ON ULTRA-THICK METALS
13101890 ADAPTIVE FIN DESIGN FOR FINFETS
13112828 SEMICONDUCTOR DEVICE HAVING A BONDING PAD AND SHIELD STRUCTURE OF DIFFERENT THICKNESS
13156558 CHEMICAL MECHANICAL POLISHING (CMP) METHOD FOR GATE LAST PROCESS
13210962 INTEGRATED CIRCUITS
13273527 SELECTIVE FIN-SHAPING PROCESS USING PLASMA DOPING AND ETCHING FOR 3-DIMENSIONAL TRANSISTOR APPLICATIONS
13346995 Structures for Preventing Cross-talk Between Through-Silicon Vias and Integrated Circuits
13362913 BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS
13436149 METHODS AND APPARATUS FOR SRAM CELL STRUCTURE
13475297 METAL GATE FINFET DEVICE AND METHOD OF FABRICATING THEREOF
13487860 STRAINED STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE STRAINED STRUCTURE
13559840 Elongated Bumps in Integrated Circuit Devices
13560200 PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE
13563470 SEMICONDUCTOR INTEGRATED CIRCUIT WITH METAL GATE
13691093 Controlling the Shape of Source/Drain Regions in FinFETs
13710377 INTEGRATED SEMICONDUCTOR STRUCTURE FOR SRAM AND FABRICATION METHODS THEREOF
13712665 MOLDED CHIP INTERPOSER STRUCTURE AND METHODS
13715684 FinFET with Embedded MOS Varactor and Method of Making Same
13745205 SEMICONDUCTOR DEVICE HAVING MODIFIED PROFILE METAL GATE
13757510 Fin-Like Field Effect Transistor (FinFET) Device and Method of Manufacturing Same
13772008 BACK SIDE ILLUMINATION (BSI) SENSORS, MANUFACTURING METHODS THEREOF, AND SEMICONDUCTOR DEVICE MANUFACTURING METHODS
13787465 BUMP STRUCTURES FOR SEMICONDUCTOR PACKAGE
13800663 END-TO-END GAP FILL USING DIELECTRIC FILM
13864676 PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE
13867831 EMBEDDED 3D INTERPOSER STRUCTURE
13962180 METHODS TO STOP CONTACT METAL FROM EXTRUDING INTO REPLACEMENT GATES
13974430 INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
14016996 MECHANISMS FOR FORMING IMAGE SENSOR DEVICE
14147851 SEMICONDUCTOR DEVICE AND FORMATION THEREOF
14163302 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
14206248 PACKAGES WITH THROUGH-VIAS HAVING TAPERED ENDS
14208744 BUMP STRUCTURE AND METHOD FOR FORMING THE SAME
14210817 BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS
14215296 SEMICONDUCTOR DEVICE HAVING A BONDING PAD AND SHIELD STRUCTURE AND METHOD OF MANUFACTURING THE SAME
14220930 Adaptive Fin Design for FinFETs
14276784 SEMICONDUCTOR PACKAGE AND METHOD
14447223 METHOD OF MANUFACTURING A FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE
14464315 MULTI-GATE DEVICE STRUCTURE INCLUDING A FIN-EMBEDDED ISOLATION REGION AND METHODS THEREOF
14495399 METHOD OF FORMING PACKAGE SYSTEMS HAVING INTERPOSERS
14510706 INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS
14584783 METAL GATE FINFET DEVICE
14598276 SELECTIVE FIN-SHAPING PROCESS
14609031 Controlling the Shape of Source/Drain Regions in FinFETs
14615264 INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
14657312 SOURCE/DRAIN REGIONS FOR FIN FIELD EFFECT TRANSISTORS AND METHODS OF FORMING SAME
14715112 Methods and Apparatus for SRAM Cell Structure
14719090 FINFET WITH EMBEDDED MOS VARACTOR AND METHOD OF MAKING SAME
14720824 Distributed Metal Routing
14725555 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
14739418 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
14830089 METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PROTECTION LAYER
14836019 SELF-ALIGNED BACK SIDE DEEP TRENCH ISOLATION STRUCTURE
14839047 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
14875923 METHOD OF MAKING A STRAINED STRUCTURE OF A SEMICONDUCTOR DEVICE
14879710 BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS
14879880 METHOD FOR FORMING PACKAGE SYSTEMS HAVING INTERPOSERS
14927218 METHODS OF FORMING MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
14928604 IMAGE SENSOR WITH WIDE CONTACT
14937529 FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE AND METHOD OF MANUFACTURING SAME
14941215 STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE
14952733 SEMICONDUCTOR DEVICE HAVING MODIFIED PROFILE METAL GATE
14985504 LID STRUCTURE FOR A SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
15064402 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
15130032 SEMICONDUCTOR DEVICE AND FORMATION THEREOF
15135185 Methods and Apparatus for SRAM Cell Structure
15171322 INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS
15210343 CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORMING THE SAME
15213179 Multi-Gate Device Structure Including a Fin-Embedded Isolation Region and Methods Thereof
15414264 SOURCE/DRAIN REGIONS FOR FIN FIELD EFFECT TRANSISTORS AND METHODS OF FORMING SAME
15414449 Structure and Formation Method of Semiconductor Device with Metal Gate
15429844 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH SEPARATED MERGED SOURCE/DRAIN STRUCTURE
15472814 METHOD FOR MANUFACTURING IMAGE SENSOR STRUCTURE HAVING WIDE CONTACT
15492059 SEMICONDUCTOR DEVICE
15597452 METHOD OF FORMING ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
15609206 Thermal Interface Material Having Different Thicknesses In Packages
15614274 Method of Fabricating a Semiconductor Device Having Modified Profile Metal Gate
15652012 STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE
15658588 SELF-ALIGNED BACK SIDE DEEP TRENCH ISOLATION STRUCTURE
15668315 PACKAGES WITH THROUGH-VIAS HAVING TAPERED ENDS
15692212 Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
15700468 Structure and Method for FinFET Device with Asymmetric Contact
15706141 Methods of Forming Multi-Die Package Structures Including Redistribution Layers
15714167 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
15719395 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
15719500 SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
15719511 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
15800962 PACKAGING WITH SUBSRTATES CONNECTED BY CONDUCTIVE BUMPS
15804311 Method for Forming a Lid Structure for a Semiconductor Device Package
15820961 METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PROTECTION LAYER
15898785 Fin-Like Field Effect Transistor (FinFET) Device and Method of Manufacturing Same
15906092 SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE AND METHOD OF FABRICATING THEREOF
15957914 PACKAGE ON PACKAGE STRUCTURE
16008302 SRAM STRUCTURE
16014821 Embedded 3D Interposer Structure
16017795 STRUCTURE OF SEMICONDUCTOR DEVICE STRUCTURE HAVING FINS
16035910 PACKAGES WITH THROUGH-VIAS HAVING TAPERED ENDS
16043371 SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME
16043510 STRUCTURE AND METHOD FOR FINFET DEVICE WITH ASYMMETRIC CONTACT
16049015 Thermal Interface Material Having Different Thicknesses in Packages
16049059 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH SEPARATED MERGED SOURCE/DRAIN STRUCTURE
16118744 Method and Structure for Semiconductor Device Having Gate Spacer Protection Layer
16124337 METHOD FOR FORMING BUMP STRUCTURE
16136339 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
16138099 Integrated Circuit Package and Method
16164752 CHIP PACKAGE AND METHOD OF FORMING THE SAME
16190608 ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
16226088 SEMICONDUCTOR DEVICE INCLUDING A LINER LAYER BETWEEN A CHANNEL AND A SOURCE/DRAIN EPITAXIAL LAYER
16420576 ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
16511176 GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME
16530404 SRAM STRUCTURE AND METHOD FOR MANUFACTURING SRAM STRUCTURE
16564317 STRUCTURE AND METHOD FOR FINFET DEVICE WITH ASYMMETRIC CONTACT
16572438 SEMICONDUCTOR DEVICE HAVING MODIFIED PROFILE METAL GATE
16585636 Structure and Method for Semiconductor Devices
16593382 Embedded 3D Interposer Structure
16654175 SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME
16661675 SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
16671563 Fin-Like Field Effect Transistor (FinFET) Device and Method of Manufacturing Same
16689101 PACKAGE ON PACKAGE STRUCTURE
16693627 ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
16696645 SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE
16707908 Integrated Circuit Package and Method
16720853 Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
16739868 MEMORY DEVICE AND METHOD OF FABRICATING THE MEMORY DEVICE
16782858 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
16829295 Packages with Through-Vias Having Tapered Ends
16871983 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
16902190 Structure of Semiconductor Device Structure Having Fins
16933541 METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE
16937901 SEMICONDUCTOR DEVICE
16940264 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
16983752 Structure and Method for FinFET Device with Asymmetric Contact
17002042 ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
17012255 Thermal Interface Material Having Different Thicknesses in Packages
17028683 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
17068389 Multi-Die Package Structures Including Redistribution Layers
17079863 SRAM STRUCTURE AND METHOD FOR MANUFACTURING SRAM STRUCTURE
17103611 SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
17107484 Method and Structure for Semiconductor Device Having Gate Spacer Protection Layer
17155467 SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME
17175816 Gate-All-Around Structure and Methods of Forming the Same
17200272 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
17244598 Integrated Circuit Package and Method
17301467 SEMICONDUCTOR DEVICE HAVING MODIFIED PROFILE METAL GATE
17316582 GATE ALL-AROUND SEMICONDUCTOR DEVICE
17401728 MEMORY DEVICE AND METHOD OF FABRICATING THE MEMORY DEVICE
17590409 Structure and Method for Semiconductor Devices
17664129 CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
17672719 PACKAGE ON PACKAGE STRUCTURE
17730213 CHIP PACKAGE AND METHOD OF FORMING THE SAME
17814842 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
17815839 VIAS FOR COBALT-BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
17827457 Structure and Method for FinFET Device with Asymmetric Contact
17833373 SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE
17837704 Method and Structure for Semiconductor Device Having Gate Spacer Protection Layer
17873962 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
17874170 SEMICONDUCTOR DEVICE
17980914 Integrated Circuit Package and Method
18063711 SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME
18305584 Gate-All-Around Structure and Methods of Forming the Same
18312844 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
18313190 Structure of Semiconductor Device Structure Having Fins
18337044 CHIP PACKAGE AND METHOD OF FORMING THE SAME
18338364 SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
18360508 Structure and Method for Semiconductor Devices
18422550 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
18444959 Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
18519862 CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
18598250 MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
18637874 SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME
18656133 Structure and Method for FinFET Device with Asymmetric Contact
18659033 PACKAGE ON PACKAGE STRUCTURE
18662544 SEMICONDUCTOR DEVICE
18676539 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
18733499 GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME
18733674 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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